Sr Wafer Bonding Equipment Engineer (Engineering)

The qualified candidate should possess equipment knowledge of EVG Gemini wafer bonding systems and have an understanding of its support equipment. They must be competent in troubleshooting problems and capable of applying logic to isolate and determine root cause. They must be self-motivated and able to work with minimal instruction. Candidate must have demonstrated the ability to make good decisions with limited time and data in a quickly changing environment. The candidate will be expected to deal with multiple issues and shifting priorities. They must be able to interact professionally with manufacturing, process engineering and maintenance to deal with these issues and priorities. The candidate must have strong verbal and written communication skills. Previous EVG wafer bonding equipment engineering experience is required, additional semiconductor equipment engineering experience is advantageous.

Responsibilities:

Equipment Engineering ownership of Wafer Bonding tools and support equipment, primarily: EVG Gemini 560 wafer bonder, SUSS ABC200 wafer bonder, Genmark robots, AMAT PVD, AMAT 9500 Implanter systems.

• Improving tool reliability and availability.
• Identifying and reducing sources of variation.
• Preventing and reducing wafer scrap.
• Reducing defectivity.
• Defining required scheduled and preventative maintenance intervals.
• Improving process monitoring and sensor capabilities.
• Reducing cost of ownership.
• Identifying and qualifying alternate parts.
• Supporting development activities.
• Developing and writing specifications and standard work documentation.
• Implementation of Six-Sigma statistical process control methods.
• Participating in and/or leading cross-functional and lean activity teams.

Additional candidate expectations:

• Competent troubleshooter capable of applying logic to isolate and resolve problems.
• Ability to deal with multiple issues and shifting priorities.
• Strong verbal and written communication skills.
• Ability to interact professionally with manufacturing and process engineering to deal with shifting issues and priorities.
• Solid knowledge of process control, sampling optimization, data analysis and interpretation.
• Good foundational problem solving skills with creative thinking when required.
• Self-motivated; able to take initiative and effectively prioritize work for self.
• A strong desire to create a positive, winning, world class working environment.
• Previous experience in Lean Manufacturing methods is highly desirable.

Eligibility:

• BS in Engineering or equivalent.
• 3-5 years of experience with ownership and responsibility for the maintenance, troubleshooting, repair and equipment productivity in a manufacturing environment.
• Experience in Wafer Bonding Equipment Engineering/Field Service.
• Semiconductor Manufacturing experience is desirable.
• Equipment engineering experience across multiple areas (Films/Implant/Etch/Metrology) is also desirable.

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.